Fin is an important part of air cooling toshiba satellite a10-203 laptop fan radiator, no heat radiator, heat conduction cannot be achieved, it is impossible to will CPU heat away a lot. Influence fin characteristic factors have material, contact area, bottom thickness, convection heat exchange area and fin of fins and air flow direction of consistency.
1. Fin material
In metal materials, silver of the toshiba qosmio x300 series laptop cpu cooling fan thermal conductivity of the highest, but the cost is high, Pure copper second, but processing is not easy. Air cooling of radiator fin generally USES 6063 t5 aluminum alloy, this is because of the aluminum alloy good workability (pure aluminium due to insufficient hardness, it is difficult to cutting processing), surface treatment easily, low cost. But as the cooling demand increase, comprehensive use of various high coefficient of thermal conductivity of the material is the trend of The Times. Some fin adopted pure copper or copper aluminum combination way to manufacture. For example, some radiator bottom using pure copper, it is to play copper coefficient of thermal conductivity, the heat transfer quantity relatively large advantages, and fins of the section is aluminum alloy sheet, is in order to easy processing, will heat exchange area as far as possible, so that convection heat transfer increases. But this method is the most difficult point lies in how to copper and aluminum type fins fully connection, if the connection is not good, it will influence the effect of heat dispelling.
2. Contact area
According to the theory of heat transfer and the quantity of heat conduction is proportional to the contact area. For CPU air cooled radiator is concerned, CPU toshiba qosmio x305 series laptop cpu cooling fan surface area has more and more small, contact area has been limited, and radiator bottom and CPU surface can't completely smooth, so need to choose the proper heat conduction medium fill the void, in order to increase the contact area, achieve the quantity of heat of the heat source of the purpose of take away. Fin suction quantity of heat to try to pass to fins to convection heat exchange, this mainly by increasing fins and fin contact area to achieve, fins bottom and fin base the joint of the arc shape, is to increase the contact area.
3. Radiator bottom thickness
Radiator bottom is the function of CPU heat to a large number of suction go, if insufficient thickness of bottom, radiator of the heat capacity is insufficient, the heat transfer quantity will be limited, fin wall temperature will rise. When the computer shutdown, fan then stop running, forced convection is terminated, but CPU toshiba qosmio x505 series laptop cpu cooling fan residual heat to heat radiator and did not immediately terminated, also requires fin have enough heat capacity space will be to ensure that the processor's residual heat away, to protect the CPU. Therefore the bottom of the heat sink must ensure that is of a great enough thickness, for celeron, 2 mm ~ 3.5 mm thickness of bottom can fully satisfy endothermic demand; For Ⅲ pentium processor (copper), bottom thickness is 4 mm ~ 5.5 mm is can completely satisfy the endothermic demand; But for duron or thunderbird processor, bottom thickness need 5 mm above can meet the endothermic demand. Of course, for the same type of processor, power consumption is different, endothermic demand is also different.
4. Heat exchange area
Fin task in addition to responsible for the quantity of heat of heat source of suction to outside, another task is to provide enough heat exchange area, in the fan convection with from CPU toshiba qosmio x500 series laptop cpu cooling fan place suction to heat timely send out into the air. And is responsible for the send out quantity of heat is the main part of the radiator fins. Convection heat exchange area is larger, the greater the change quantity of heat, of course, also must cooperate with air volume air pressure are large enough fan can be achieved. So choose radiator, want to choose radiator fin piece is more dense.
http://laptopaccessories.zohosites.com/blogs/post/Notebook-hard-disk-common-failure-analysis/
http://laptop-keyboard88.blogspot.com/2012/10/the-blank-space-key-of-usage.html
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